Habib A. Mustain received his PhD in Electrical Engineering from the University of Arkansas in 2006.  He joined Texas Instruments in Dallas in 2007, as a Product Engineer. In September 2009, he moved to Trumpf Photonics as Senior Packaging engineer. From 2011-2019, he was a senior packaging engineer in Power and RF division at Cree/Wolfspeed. He currently works for Heraeus Electronics as a Power Electronics Segment Manager Americas. In that position, he leads and develops low-inductance power module design using multilayer ceramic substrates, as well as engaging with R&D and the development team on new product introduction into market. He supports and engages in technical discussions with key customers in power modules/discrete packaging activities, supports sales and marketing teams to promote packaging material solutions for power electronics/automotive customers, and provides technical advice/support for the customer solutions groups.  He has several journal publications to his credit, and has presented at a number of conferences.  Dr. Mustain currently lives in Cary, NC, with his wife and two kids. He enjoys hiking, traveling, and watching cricket games.